If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...

TSV interconnects are critical to the development of 3D-ICs since they enable through-chip communication between the vertically stacked device layers. Currently, most TSVs employ a solid copper via ...

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...

New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity Calibre 3DStress delivers early analysis/simulation of chip/package interactions at ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...