So, you’re trying to get a handle on BGA flip chip tech? It’s one of those things that sounds complicated, but once you break ...
Fullerton, Calif. — Designed for the termination of high-speed applications, TT electronics BI Technologies Electronic Components Division's RoHS-compliant SCSI termination resistor network is aimed ...
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LG Innotek’s ‘Dream Factory’ revolutionizes chip substrate production with AI, robotics
LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...
A new BGA-compatible SCSI line termination network is designed for use in high-frequency and space sensitive applications compliant to SPI-2, SPI-3 and above. Designated part number BB1020DT, the ...
Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...
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