Destination 2D's CMOS-compatible interconnect design innovation is achieved via intercalation-doped and edge-contacted multi-layer graphene, which delivers lower resistivity, significantly better ...

OFC 2026 - TeraSignal, a leader in intelligent interconnect technology today announced the TeraSignal TS5802, the world's most advanced analog equalizer, implemented in advanced CMOS technology and ...

Anthony Paul Bellezza the inventor of a 2D Graphene fusion process being used for CMOS Chip assembly processes, that fuses interconnects at temperatures within the thermal budget of the chip below 400 ...

DARPA, Intel, and Ayar Labs collaborate on developing 100-Tb/s-plus in-package silicon photonic interfaces. Ayar’s TeraPHY chiplet combines silicon photonics and CMOS in a flip-chip SiP. Thermal ...

I’m at the 15th Annual IEEE Hot Interconnects conference at Stanford today and every presentation so far has been an eye-opener. I’ll be blogging a lot of ideas from the conference this week, but I ...

Innovative CMOS Re-Driver for 800G Linear Pluggable Optical (LPO) Modules Reduces Power By Up to 50% and Adds Link Training and Diagnostics to Enable Mass Adoption of LPO Modules IRVINE, Calif. , ...

Silicon bonding technology promises optimized density, power efficiency, and performance In conjunction with Raytheon Vision Systems, wafer-bonding-process developer Ziptronix (Morrisville, NC) has ...

TeraSignal, a leader in intelligent interconnect technology, today announced that it will demonstrate CMIS-based link training for linear optics and copper interconnec ...

It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...