EDN

HI from Hot Interconnects: Luxtera’s New CMOS Photonic Cable

I’m at the 15th Annual IEEE Hot Interconnects conference at Stanford today and every presentation so far has been an eye-opener. I’ll be blogging a lot of ideas from the conference this week, but I ...
WIVB-TV

2D Graphene Interconnects for CMOS and Integrated Circuits

Anthony Paul Bellezza the inventor of a 2D Graphene fusion process being used for CMOS Chip assembly processes, that fuses interconnects at temperatures within the thermal budget of the chip below 400 ...
Electronic Design

CMOS Plus On-Chip Electro-Optical Interconnect Zooms Past 2 Tb/s

DARPA, Intel, and Ayar Labs collaborate on developing 100-Tb/s-plus in-package silicon photonic interfaces. Ayar’s TeraPHY chiplet combines silicon photonics and CMOS in a flip-chip SiP. Thermal ...
Yahoo Finance

TeraSignal Delivers Industry’s First Intelligent Redriver for 200G+ Copper Interconnects

Breakthrough CMOS device built on TeraSignal’s TSAFE™ analog front-end architecture integrates CMIS-based link training with Advanced Equalization to dramatically improve link margin, reach, and ...
Longview News-Journal

Destination 2D Brings Graphene to Mainstream CMOS - Breakthrough Interconnect Technology at Wafer Scale to Revolutionize Next-Generation Energy-Efficient Chips

A CMOS-compatible synthesis technology allows for the direct synthesis of graphene onto wafer-scale dielectric substrates at temperatures significantly below the CMOS thermal budget. All of this is ...
EDN

3-D interconnect integrates CMOS ICs

Silicon bonding technology promises optimized density, power efficiency, and performance In conjunction with Raytheon Vision Systems, wafer-bonding-process developer Ziptronix (Morrisville, NC) has ...
Business Wire

Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022

Avicena is showing ultra-fast microLED links operating at 14Gbps per lane as part of its LightBundle TM multi-Terabit interconnect technology MOUNTAIN VIEW, Calif. & BASEL, Switzerland--(BUSINESS WIRE ...
ExtremeTech

Move Over Graphene: IBM Expects Copper Interconnects to Hold the CMOS Line

It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...
WRIC

TeraSignal Announces Industry's First CMOS Intelligent Re-Drivers to Transform AI and Compute Interconnects

Innovative CMOS Re-Driver for 800G Linear Pluggable Optical (LPO) Modules Reduces Power By Up to 50% and Adds Link Training and Diagnostics to Enable Mass Adoption of LPO Modules IRVINE, Calif. , ...