Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

In the automotive industry, especially in lightweight construction for hybrids and electric vehicles, there is growing demand for components that are not just light, but also exhibit high stiffness ...