Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...

There are some realities of life that you can’t change, like taxes. Another is that an automotive supplier must have the ability to produce a composite part in a minute, or at least in minutes — not ...

The importance of digital tools and simulation for successful composite parts design is well established, whether for aircraft wings, automotive bumper beams or bicycle frames. Over the past decade, ...

In the automotive industry, especially in lightweight construction for hybrids and electric vehicles, there is growing demand for components that are not just light, but also exhibit high stiffness ...