Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

To further shrink electronic devices and to lower energy consumption, the semiconductor industry is interested in using 2D materials, but manufacturers need a quick and accurate method for detecting ...

A joint research team led by Dr. Hee-Eun Song of the Photovoltaics Research Department at the Korea Institute of Energy Research (President Yi Chang-Keun, hereafter “KIER”) and Prof. Ka-Hyun Kim of ...

ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.

With the continuous optimization of China's energy structure and the rapid expansion of natural gas consumption, high grade steel large diameter gas pipelines have become increasingly indispensable in ...