Ten-year TIM1/TIM1.5 forecast for advanced semiconductor packaging (ASP) split by graphene, liquid metal, thermal gel, and indium foil. 10-year forecast for microfluidic cooling. Detailed analysis on ...
The market size of next-generation thermal interface materials TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036 As semiconductor packaging surges ...
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