Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Building on its ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Vinci today announced the ...

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Consider the inside of a typical wind turbine nacelle. It will contain a gearbox, electrical controls, a generator, hub mounting, blade controls, and several other major systems. In the case of ...

The use of fiber-reinforced composites in Type 3, 4 and linerless Type 5 pressure vessels is growing, used to store compressed/renewable natural gas (CNG/RNG) and hydrogen as part of the global ...

Learn how industrial computed tomography (CT), digital twins and collaborative platforms are improving workflows across design, simulation, manufacturing and inspection in machine engineering from ...

Siemens NX X product for engineering software moves to the cloud to enhance multidiscipline design capabilities. A new level of service brings immersive collaboration, electro-mechanical workflows and ...