Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and ...

Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, ...

Design for test takes on new urgency in complex multi-die assemblies, where it can be used to minimize downstream errors and the cost of fixing them. DFT needs to be increasingly detailed due to more ...