ASE Technology remains well-positioned to benefit from persistent advanced packaging bottlenecks. Read why ASX stock is a Buy ...

Circle packing encapsulates the challenge of optimally arranging a set of circles within a given container without overlap, a process that has profound implications in both theoretical mathematics and ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

As Intel works to regain its manufacturing edge over TSMC, the company is also expanding its advanced packaging capacity. Complex chips like AI accelerators use advanced packaging techniques instead ...