Researchers developed a method that gradually adds and removes atoms in simulations, enabling realistic modeling of crystal defects that affect material strength.

Researchers and industries have been using transmission electron microscopy (TEM) to study semiconductors' stacking and dislocation faults. This article considers the analysis of crystal structures.

Most materials, especially metals and ceramics, are crystals. Their atoms are arranged in three-dimensional lattices that repeat the same exact pattern, over and over again. But there's a well-known ...