Researchers and industries have been using transmission electron microscopy (TEM) to study semiconductors' stacking and dislocation faults. This article considers the analysis of crystal structures.

Researchers developed a method that gradually adds and removes atoms in simulations, enabling realistic modeling of crystal defects that affect material strength.

Quantum engineers have spent years trying to tame the fragility of qubits, only to be thwarted by the tiniest imperfections in the materials they use. Now a new line of research flips that problem on ...