Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

Generic test and repair approaches to embedded memory have hit their limit. Smaller feature sizes, such as 130 nm and 90 nm, have made it possible to embed multiple megabits of memory into a single ...

Vincent Ratford, vice president of marketing and business development at Virage Logic (Fremont, Calif.), knows about providing design solutions for IC companies. Earlier, he was director of marketing ...

In advanced process nodes, the severe decoupling between SRAM scaling stagnation and logic circuit scaling, combined with the surging on-chip memory demands from Large Language Model (LLM) training ...

The Self-Test and Repair (STAR) Memory System enables automated test vector generation, silicon debug, and fault isolation and classification in IC memory designs. Version 4.0 of the memory ...

In a recent study published in the journal Nature, researchers found that the recruitment of neurons to memory circuits is preceded by a cascade of molecular events induced during learning, which ...