Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

IsoShield technology enables isolated power modules with up to three times higher power density than discrete solutions, shrinking solution size as much as 70%. Joining TI's portfolio of over 350 ...

The TPS84610 supports input voltages from 2.95 V to 6 V, generates a low 0.8-V output and has an adjustable switching frequency from 500 kHz to 2 MHz. The 9-mm x 11-mm x 2.8-mm low-noise module meets ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Texas Instruments (NasdaqGS:TXN) has introduced new isolated power modules that use its proprietary IsoShield packaging ...

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Texas Instruments (TI) is shaking up the power design game with the introduction of groundbreaking MagPack™ technology. This innovative packaging technique shrinks the size of power modules by up to ...

U.S. semiconductor corporations Texas Instruments Incorporated (TI) unveiled two new isolated power modules that raise power density and can be applied to data centers and electric vehicles: ...

DALLAS - Texas Instruments (NASDAQ:TXN) today introduced isolated power modules featuring its IsoShield technology, which the company states delivers up to three times higher power density than ...