QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers.

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules.

This March, Electronic Specifier's Associate Editor, Sheryl Miles, takes a look at the top 5 power products released in March ...

Pushing power limits in data centres? These modules enable smaller converters, less heat, and a shift from IGBT designs ...

TDK Corporation has introduced the TDK-Lambda i1R ORing FET modules, capable of operating at 60A or 80A with a maximum input voltage of 60Vdc. These ORing modules are designed to replace traditional ...

The company performs non-destructive fault analysis on chips, discrete components, sensors, LEDs and power modules using ...

The laboratory’s National Ignition Facility has repeatedly ignited fusion plasma using what is currently the world’s largest laser, achieving steadily increasing energy surpluses in the process.

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

Summary onsemi announced a new design win with Sineng Electric, which will feature onsemi’s latest‑generation hybrid power integrated module ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature ...