Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Voyager Technologies CEO Dylan Taylor said data centers in space will become a reality, but cooling issues still need to be resolved. Tesla CEO Elon Musk highlighted space-based data centers as a ...

Since the dawn of the computer age, researchers have wrestled with two persistent challenges: how to store ever-increasing reams of data and how to protect that information from unintended access. Now ...

The Trump administration and a bipartisan group of 13 governors announced an agreement urging the PJM Interconnection — the largest electric grid operator in the U.S. — to “…expand the energy supply, ...

Abstract: To address the growing demand for intelligent manufacturing in personalized, large-scale, and multivariety production, multirobot systems have demonstrated significant potential, as they can ...