TDK Corporation has introduced the TDK-Lambda i1R ORing FET modules, capable of operating at 60A or 80A with a maximum input ...

Pushing power limits in data centres? These modules enable smaller converters, less heat, and a shift from IGBT designs ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature ...

The company performs non-destructive fault analysis on chips, discrete components, sensors, LEDs and power modules using ...

This automotive-compliant multi-phase SPI boost controller is designed to meet the power density, efficiency, EMI, and ...

SemiQ, a US developer of SiC solutions, has launched the QSiC Dual3, a family of 1200 V half-bridge MOSFET modules for motor ...

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules.

Microchip Technology has announced its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High ...

Looking for a versatile laser engraver that delivers both safety and precision? Meet the sculpfun G9 Portable Fiber Laser Engraver—your new go-to tool for all your engraving projects! Whether you're a ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

The Chinese solar panel manufacturer presented its technology range at the Tokyo renewable energy trade show targeting Asian ...

We have previously written about various industrial Raspberry Pi systems and gateways that come with RS-485 built in, but we ...